data sheet no. pd60208 rev. b IR2175(s) block diagram packages product summary v offset 600vmax i qbs 2ma v in +/-260mvmax gain temp.drift 20ppm/ o c (typ.) f o 130khz (typ.) overcurrent trip 2 sec (typ) signal delay overcurrent trip level +/-260mv (typ.) linear current sensing ic 8 lead pdip 8 lead soic features ? floating channel up to +600v ? monolithic integration ? linear current feedback through shunt resistor ? direct digital pwm output for easy interface ? low i qbs allows the boot strap power supply ? independent fast overcurrent trip signal ? high common mode noise immunity ? input overvoltage protection for igbt short circuit condition ? open drain outputs description the IR2175 is a monolithic current sensing ic de signed for motor drive applications. it senses the motor phase current through an external shunt resistor, converts from analog to digital signal, and transfers the signal to the low side. ir?s proprietary high voltage isolation tech- nology is implemented to enable the high bandwidth signal processing. the output format is discrete pwm to eliminate need for the a/d input interface for the IR2175. the dedicated overcurrent trip (oc) signal fa- cilitates igbt short circuit protection. the open-drain outputs make easy for any interface from 3.3v to 15v. s (refer to lead assignments for cor- rect pin configuration). this/these diagram(s) show electrical connec- tions only. please refer to our appli- cation notes and designtips for proper circuit board layout. vb v+ vs vcc po com IR2175 gnd 15v to motor phase pwm output up to 600v oc overcurrent
2 IR2175 (s) www.irf.com recommended operating conditions the output logic timing diagram is shown in figure 1. for proper operation the device should be used within the recommended conditions. note 1: capacitors are required between v b and vs when bootstrap power is used. the external power supply, when used, is required between v b and vs pins. symbol definition min. max. units v b high side floating supply voltage v s +13.0 v s +20 v s high side floating supply offset voltage 0.3 600 v po digital pwm output voltage com vcc v oc overcurrent output voltage com vcc v cc low side and logic fixed supply voltage 9.5 20 v in input voltage between v in+ and v s -260 +260 mv t a ambient temperature -40 125 c v symbol definition mi n. max. units v s high side offset voltage -0.3 600 v bs high side floating supply voltage -0.3 25 v cc low side and logic fixed supply voltage -0.3 25 v in maximum input voltage between v in+ and v s -5 5 v po digital pwm output voltage com -0.3 vcc +0.3 v oc overcurrent output voltage com -0.3 vcc +0.3 dv/dt allowable offset voltage slew rate ? 50 v/ns p d package power dissipation @ t a +25c 8 lead soic ? .625 8 lead pdip ? 1.0 rth ja thermal resistance, junction to ambient 8 lead soic ? 200 8 lead pdip ? 125 t j junction temperature ? 150 t s storage temperature -55 150 t l lead temperature (soldering, 10 seconds) ? 300 absolute maximum ratings absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. all voltage parameters are absolute voltages referenced to com, all currents are defined positive into any lead. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. v c/w w c
3 IR2175 (s) www.irf.com note 1: 10mv offset represents 1.5% duty cycle fluctuation note 2: gain = (full range of duty cycle in %) / (full input voltage range). v in nominal input voltage range before saturation -260 ? 260 v in+ _ v s v oc+ overcurrent trip positive input voltage ? 260 ? v oc- overcurrent trip negative input voltage ? -260 ? v os input offset voltage -10 0 10 v in = 0v (note 1) ? v os / ? t a input offset voltage temperature drift ? 25 ? v/ o c g gain (duty cycle % per v in ) 155 160 165 %/v max gain error=5% (note 2) ? g / ? t a gain temperature drift ? 20 ? ppm/ o c i lk offset supply leakage current ? ? 50 a v b = v s = 600v i qbs quiescent v bs supply current ? 2 ? v s = 0v i qcc quiescent v cc supply current ? ? 0.5 lin linearity (duty cycle deviation from ideal linearity ? 0.5 1 % curve) ? v lin / ? t a linearity temperature drift ? .005 ? %/ o c i opo digital pwm output sink current 20 ? ? 2?? i occ oc output sink current 10 ? ? 1?? dc electrical characteristics v cc = v bs = 15v, and t a = 25 o unless otherwise specified. symbol definition min. typ. max. units test conditions ma mv ma v o = 1v v o = 0.1v v o = 1v v o = 0.1v symbol definition min. typ. max. units t est conditions propagation delay characteristics fo carrier frequency output 100 140 180 khz ? f / ? t a temperature drift of carrier frequency ? 500 ? ppm/ o c dmin minimum duty ? 9 ? % dmax maximum duty ? 91 ? % v in +=+260mv bw fo bandwidth ? 15 ? khz phs phase shift at 1khz ? -10 ? o tdoc propagation delay time of oc 1 2 ? twoc low true pulse width of oc ? 1.5 ? ac electrical characteristics v cc = v bs = 15v, and t a = 25 o unless otherwise specified. figure 1 v in = 0 & 5v v in +=-260mv, v in + = 100mvpk -pk sine wave, gain=-3db v in + =100mvpk-pk sine wave sec
4 IR2175 (s) www.irf.com application hint: temperature drift of the output carrier frequency can be cancelled by measuring both a pwm period and the on-time of pwm (duty) at the same time. since both periods vary in the same direction, computing the ratio between these values at each pwm period gives consistent measurement of the current feedback over the temperature drift. vin+= -260mv vs = 0v vin+= +260mv vs = 0v duty=91% duty=9% carrier frequency = 130khz po po timing waveforms figure 1 output waveform
5 IR2175 (s) www.irf.com lead assignment lead definitions symbol description v cc low side and logic supply voltage com low side logic ground v in+ positive sense input v b high side supply v s high side return po digital pwm output oc overcurrent output (negative logic) n.c. no connection IR2175 8 7 6 4 3 2 1 vcc oc po com nc vs vin+ vb 5 8 lead pdip IR2175s 8 7 6 4 3 2 1 vcc oc po com nc vs vin+ vb 5 8 lead soic
6 IR2175 (s) www.irf.com data and specifications subject to change without notice. 2/ 16/2004 case outlines 01-6014 01-3003 01 (ms-001ab) 8 lead pdip 01-6027 01-0021 11 (ms-012aa) 8 lead soic 87 5 65 d b e a e 6x h 0.25 [.010] a 6 4 3 12 4. ou t l i ne conf or ms t o j e de c ou t l i ne ms - 012aa. not e s : 1. dime ns ioning & t olerancing pe r as me y14.5m-1994. 2. cont rolling dime ns ion: millime t er 3. dime ns ions are s hown in millime t e rs [inches ]. 7 k x 45 8x l 8x c y footprint 8x 0.72 [.028] 6.46 [.255] 3x 1.27 [.050] 8x 1.78 [.070] 5 dime ns ion doe s not incl u de mol d pr ot ru s ions . 6 dime ns ion doe s not incl u de mol d pr ot ru s ions . mold prot rus ions not t o exceed 0.25 [.010]. 7 dimension is t he lengt h of lead for soldering t o a s ubs t rat e. mold prot rus ions not t o exceed 0.15 [.006]. 0.25 [.010] cab e1 a a1 8x b c 0.10 [.004] e1 d e y b a a1 h k l .189 .1497 0 .013 .050 bas ic .0532 .0040 .2284 .0099 .016 .1968 .1574 8 .020 .0688 .0098 .2440 .0196 .050 4.80 3.80 0.33 1.35 0.10 5.80 0.25 0.40 0 1.27 bas ic 5.00 4.00 0.51 1.75 0.25 6.20 0.50 1.27 mi n max mi l l i me t e r s inches mi n max dim 8 e c .0075 .0098 0.19 0.25 .025 bas ic 0.635 bas ic
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